The semiconductor field is rich in technological diversity. Devices and integrated circuits
may be fabricated on silicon, gallium arsenide (GaAs), silicon germanium (SiGe), silicon
on insulator (SOI), silicon on sapphire (SOS), and silicon carbide (SiC), mercury cadmium
telluride (MerCaT), indium gallium arsnide (InGaAs), to name a few, and in technologies
ranging from 0.5um to 7nm. Add to this, package technologies ranging from ceramic,
metal case, chip scale, and plastic packaging.
- Low Power Optical Microscopy
- High Power Reflected Optical Microscopy
- Scanning Acoustic Microscopy (SAM)
- Photon Emission Microscopy
- Lock‐in Thermography
- Externally Induced Voltage Alteration (XIVA)
- Lock‐in Amplifier Augmented XIVA
- Soft Defect Localization (SDL)
- Laser Assisted Device Alteration (LADA)
- Area Defined Backside Preparation
- Area Defined Die Thinning
- Package Decapsulation
- Lock‐in Amplifier Augmented OBIC
- Optical Beam Induced Current (OBIC)
- PCB Design and Layout