Our lockin thermography tool utilizes a medium wave infrared (MWIR) thermal imaging camera coupled with a lock‐in modulation system for optimized thermal sensitivity. This technique is used to identify “hotspot” areas of abnormal or unwanted power dissipation in devices.
Lockin thermography is effective in isolating the following failure modes and mechanisms:
Lockin thermography is effective in isolating the following failure modes and mechanisms:
- Metal-to-metal shorts
- Fused silicon
- Circuits in latch-up
- Gross electrical shorts